Summary
对涂有层间绝缘材料（CCL FILM）的基板去除细微气泡及表面硬化。
Process Performance & Productivity
- 成效: VOID最小化及粘合强度增大
- Work Size: 510mm(W) * 515mm(D) * 0.1~2.5T
- Pressure Range: Max. 10kg/㎠
- Design Pressure: 12kg/㎠
- 수압 TEST Pressure: 13kg/㎠
- Pressure Uniformity: ±0.1kg/㎠
- Temp. Range: Max. 220℃
- Design Temp: 240℃
- Temp. Rising: 4℃ /min
- Cooling: Radiator
- Temp. Cooling: 2.7℃ /min
- Temp. Uniformity: ±3℃ (监测12POINT标准，样本30POINT标准)
- Vacuum pump: 5Torr / 2min
